Method for manufacturing light emitting device

ABSTRACT

A method for manufacturing a light emitting device includes the steps of: disposing a light emitting element on a base; disposing a single or plurality of light-transmissive members on the base so that the light emitting element is interposed between and spaced apart from at least one pair of opposing portions of the single or plurality of light-transmissive members; covering the base, the at least one pair of opposing portions of the single or plurality of light-transmissive members, and the light emitting element with a sealing member containing a phosphor; and cutting the base, the at least one pair of opposing portions of the single or plurality of light-transmissive members, and the sealing member, along paths on which the at least one pair of opposing portions are disposed.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of the U.S. patentapplication Ser. No. 15/417,816 filed on Jan. 27, 2017, which claimspriority to Japanese Patent Application No. 2016-015196, filed on Jan.29, 2016 and Japanese Patent Application No. 2017-006210, filed on Jan.17, 2017, the entire disclosures of which are hereby incorporated byreference in their entireties.

BACKGROUND 1. Technical Field

The present disclosure relates to methods for manufacturing lightemitting devices.

2. Description of Prior Art

Japanese Unexamined Patent Application Publication No. 2006-49524discloses a method for manufacturing a light emitting device thatincludes a light emitting element and a fluorescent material disposedaround the light emitting element so as to convert a part of originallight emitted from the light emitting element to light having adifferent wavelength than that of the original light. The methodincludes the steps of: forming a frame body with an opening of apredetermined size on a pedestal, which has an upper surface including amounting region at which the light emitting element is to be mounted, sothat the mounting region is located in an region of the upper surfaceenclosed by an inner wall of the opening; mounting the light emittingelement on the upper surface of the pedestal at an approximately centerportion of the region of the upper surface enclosed by the inner wall ofthe opening so that the light emitting element and the inner wall of theopening have an interspace therebetween having an approximately samewidth around the light emitting element; and filling a hardeningcomposition containing the fluorescent material in the interspacebetween the light emitting element and the inner wall of the opening tocover the light emitting element with the hardening composition.

SUMMARY OF THE INVENTION

A method for manufacturing a light emitting device according to anembodiment of the present disclosure includes the steps of: disposing alight emitting element on a base; disposing a single or plurality oflight-transmissive members on the base so that the light emittingelement is interposed between and spaced apart from at least one pair ofopposing portions of the single or plurality of light-transmissivemembers; covering the base, the at least one pair of opposing portionsof the single or plurality of light-transmissive members, and the lightemitting element with a sealing member containing a phosphor; andcutting the base, the at least one pair of opposing portions of thesingle or plurality of light-transmissive members, and the sealingmember, along paths on which the at least one pair of opposing portionsare disposed.

A method for manufacturing a light emitting device according to anembodiment of the present disclosure includes the steps of: disposing alight emitting element on a base; disposing a single or plurality oflight-transmissive members on the base so that the light emittingelement is interposed between and spaced apart from at least one pair ofopposing portions of the single or plurality of light-transmissivemembers; covering the base, the at least one pair of opposing portionsof the single or plurality of light-transmissive members, and the lightemitting element with a sealing member containing a phosphor; andseparating the base from the light emitting element, the single orplurality of light-transmissive members, and the sealing member; andcutting the at least one pair of opposing portions of the single orplurality of light-transmissive members and the sealing member, alongpaths on which the at least one pair of opposing portions are disposed.

The methods for manufacturing the light emitting devices according tothe embodiments of the present disclosure enable adjustment ofunevenness in chromaticity distribution of the light emitting devices.

BRIEF DESCRIPTION OF DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings.

FIG. 1A is a schematic plan view showing the structure of a lightemitting device according to a first embodiment of the presentdisclosure.

FIG. 1B is a schematic cross-sectional view showing the structure of thelight emitting device according to the first embodiment, taken alongline IB-IB in FIG. 1A.

FIG. 1C is a schematic cross-sectional view showing the structure of thelight emitting device according to the first embodiment, taken alongline IC-IC in FIG. 1A.

FIG. 2 is a flowchart showing a procedure of a method for manufacturingthe light emitting device according to the first embodiment.

FIG. 3A is a schematic cross-sectional view showing an aspect of a basepreparing step of the method for manufacturing the light emitting deviceaccording to the first embodiment.

FIG. 3B is a schematic cross-sectional view showing an aspect of a lightemitting element mounting step of the method for manufacturing the lightemitting device according to the first embodiment.

FIG. 3C is a schematic cross-sectional view showing an aspect of awiring step of the method for manufacturing the light emitting deviceaccording to the first embodiment.

FIG. 3D is a schematic cross-sectional view showing an aspect of alight-transmissive member forming step of the method for manufacturingthe light emitting device according to the first embodiment.

FIG. 3E is a schematic cross-sectional view showing an aspect of asealing member forming step of the method for manufacturing the lightemitting device according to the first embodiment.

FIG. 3F is a schematic cross-sectional view showing an aspect of a lightemitting device singulating step of the method for manufacturing thelight emitting device according to the first embodiment.

FIG. 4A is a schematic plan view showing the structure of a lightemitting device according to a modified embodiment of the firstembodiment.

FIG. 4B is a schematic cross-sectional view showing the structure of thelight emitting device according to the modified embodiment of the firstembodiment, taken along line IVB-IVB in FIG. 4A.

FIG. 5A is a schematic plan view illustrating parameters of a lightemitting device to be simulated.

FIG. 5B is a schematic cross-sectional view illustrating parameters ofthe light emitting device to be simulated, taken along line VB-VB inFIG. 5A.

FIG. 6 is a graph showing relations between directional angles andchromaticity distribution of light emitting devices havinglight-transmissive members with different widths.

FIG. 7A is a schematic plan view showing the structure of a lightemitting device according to a second embodiment of the presentdisclosure.

FIG. 7B is a schematic cross-sectional view showing the structure of thelight emitting device according to the second embodiment, taken alongline VIIB-VIIB in FIG. 7A.

FIG. 7C is another schematic cross-sectional view showing the structureof the light emitting device according to the second embodiment, takenalong line VIIC-VIIC in FIG. 7A.

FIG. 8 is a schematic cross-sectional view showing the structure of alight emitting device according to a third embodiment of the presentdisclosure.

FIG. 9 is a schematic cross-sectional view showing the structure of alight emitting device according to a modified embodiment of the thirdembodiment.

FIG. 10A is a schematic plan view showing the structure of a lightemitting device according to a fourth embodiment of the presentdisclosure.

FIG. 10B is a schematic cross-sectional view showing the structure ofthe light emitting device according to the fourth embodiment, takenalong line XB-XB in FIG. 1A.

FIG. 11 is a flowchart showing a procedure of a method for manufacturingthe light emitting device according to the fourth embodiment.

FIG. 12A is a schematic cross-sectional view showing an aspect of a basepreparing step of the method for manufacturing the light emitting deviceaccording to the fourth embodiment.

FIG. 12B is a schematic cross-sectional view showing an aspect of alight emitting element fixing step of the method for manufacturing thelight emitting device according to the fourth embodiment.

FIG. 12C is a schematic cross-sectional view showing an aspect of alight-transmissive member forming step of the method for manufacturingthe light emitting device according to the fourth embodiment.

FIG. 12D is a schematic cross-sectional view showing an aspect of asealing member forming step of the method for manufacturing the lightemitting device according to the fourth embodiment.

FIG. 12E is a schematic cross-sectional view showing an aspect of a baseremoving step of the method for manufacturing the light emitting deviceaccording to the fourth embodiment.

FIG. 12F is a schematic cross-sectional view showing an aspect of alight emitting device singulating step of the method for manufacturingthe light emitting device according to the fourth embodiment.

DESCRIPTION OF EMBODIMENTS

Light emitting devices and methods for manufacturing the same accordingto embodiments will be described with reference to the accompanyingdrawings, wherein like reference numerals designate corresponding oridentical elements throughout the various drawings. Drawings referencedin the following description schematically shows embodiments. Thus,scales of members, distances between members, and positional relationbetween members or the like may have been presented in an exaggeratedmanner, and illustration of a part of a member may have been omitted. Inthe following description, members that are the same or analogous willbe given the same name or number in principle, and duplicative detaileddescriptions will be appropriately omitted.

There is a light emitting device that emits pseudo-white light by using:a package with a recess; a light emitting element disposed on a bottomsurface of the recess and emitting blue light; and a phosphor layerwhich is contained in a resin disposed in the recess and which absorbsthe blue light and thereby emits yellow light.

The longer the length of light path from the light emitting element toan outer surface of the phosphor layer, the more the amount of the bluelight absorbed in the phosphor while the blue light emitted from thelight emitting element travels through the phosphor layer until the bluelight exits from the outer surface of the phosphor layer. That means theamount of the yellow light emitted from the light emitting device willbe increased. Therefore, a light emitting device having a longer lightpath in the phosphor layer emits more yellowish light.

When the phosphor layer is formed by potting a resin containing aphosphor over the light emitting element disposed on the bottom surfaceof the recess so as to seal the light emitting element, since in generala phosphor has higher specific gravity than that of a resin, thephosphor slowly settles down before the resin becomes hard, so that alower portion of the hardened phosphor layer has a larger amount ofphosphor than an upper portion of the hardened phosphor layer.

Consequently, a thin-profile light emitting device having a smallervertical dimension than its horizontal dimension has unevenness inchromaticity distribution of light such that light emitted from lateralsurfaces and portions near the lateral surfaces of the light emittingdevice appears yellowish compared to light emitted from a center portionof an upper surface of the light emitting device.

The recess of such a light emitting device is generally configured tohave lateral surfaces the distance between which is large so that, whenthe light emitting element is mounted on the bottom surface of therecess, a collet holding the light emitting element would not collidewith the recess. Also, the recess of such a light emitting device isgenerally configured to have lateral surfaces the distance between whichis large so that, when the light emitting element and electrodesdisposed in the recess are connected through wires, a wire bonder thatbonds the wires would not collide with the package having the recess.Such a light emitting device with a recess having lateral surfaces thedistance between which is large tends to have unevenness in chromaticitydistribution of light.

A light emitting device manufacturing method according to an embodimentof the present disclosure makes it possible to adjust chromaticitydistribution of light and provide a light emitting device whosechromaticity distribution of light has been adjusted.

First Embodiment Configuration of Light Emitting Device

Description will be given of a light emitting device according to afirst embodiment of the present disclosure with reference to FIGS. 1Aand 1B. FIG. 1A is a schematic plan view showing the structure of alight emitting device according to the first embodiment of the presentdisclosure. FIG. 1B is a schematic cross-sectional view showing thestructure of the light emitting device according to the firstembodiment, taken along line IB-IB in FIG. 1A. FIG. 1C is a schematiccross-sectional view showing the structure of the light emitting deviceaccording to the first embodiment, taken along line IC-IC in FIG. 1A.Note that, in FIG. 1A, members disposed below a sealing member 4containing a phosphor 5 is illustrated seeing through the sealing member4 and the phosphor 5.

An light emitting device 100 according to the first embodiment is of asubstantially rectangular parallelepiped shape as a whole and mainlyhas: a base 1; a light emitting element 2 disposed on the base 1; alight-transmissive member 3 disposed on the base 1, thelight-transmissive member 3 surrounding the light emitting element 2with a gap in between the light-transmissive member 3 and the lightemitting element 2; and a sealing member 4 that contains phosphor 5 andseals over the light-transmissive member 3 and the light emittingelement 2.

The base 1 is constituted by a support member 11, a first electrode 121,and a second electrode 122 and is formed in a flat-plate shape. Thefirst electrode 121 and the second electrode 122 are hereinaftersometimes referred collectively to as electrodes 12.

The support member 11 supports the first electrode 121 and the secondelectrode 122 in a predetermined arrangement. The support member 11 canbe formed of an electrically-insulative resin material. Examples of theresin materials used for the support member 11 include a thermoplasticresin and a thermosetting resin. Examples of a thermoplastic resin usedfor the support member 11 include a polyphthalamide resin, a liquidcrystal polymer, a polybutylene terephthalate (PBT), and an unsaturatedpolyester. Examples of a thermosetting resin used for the support member11 include an epoxy resin, a modified epoxy resin, a silicone resin, anda modified silicone resin. Specifically a epoxy molding compound (EMC)is preferably used.

The electrodes 12, i.e., the first electrode 121 and the secondelectrode 122, can be formed by punching a metal plate made of Cu orCu-based alloy. Note that surfaces of the first electrode 121 and thesecond electrode 122 may be Ag-plated. The first electrode 121 and thesecond electrode 122 are insulated from each other by the support member11.

The first electrode 121 constitutes a middle portion of the base 1, onwhich the light emitting element 2 is bonded (dye-bonded). Bonding thelight emitting element 2 on the first electrode 121 causes the firstelectrode 121 to serve as a thermal path through which the heatgenerated by the light emitting element 2 is transmitted to the outside.

The light emitting element 2 has two electrodes of different polarities,one of which is electrically connected through a wire 6 to an uppersurface of the first electrode 121, and the other one of which iselectrically connected through another wire 6 to an upper surface of thesecond electrode 122. The first electrode 121 and the second electrode122 each have a lower surface exposed from the support member 11.

The light emitting element 2 is a light emitting diode (LED) that emitshigh-brightness blue light using a nitride semiconductor. The lightemitting element 2 is of a face-up mounting type having positive andnegative electrodes on an upper surface thereof (surface opposite to alower surface of the light emitting element 2 which is to be joined tothe base 1). The electrodes of the light emitting element 2 areconnected through wires 6 to the first electrode 121 and the secondelectrode 122.

The light-transmissive member 3 is disposed to shorten the light pathlength of the sealing member 4 in a horizontal direction (left-rightdirection when viewed in cross-section perpendicular to a lengthwisedirection of the light-transmissive member 3). Light emitted from thelight emitting element 2 in an approximately horizontal directiontravels along a light path extending from the light emitting element 2through the sealing member 4 to a lateral surface of the light emittingdevice 100, where the light exits. The light path length of the sealingmember 4 refers to the length of the light path in the sealing member 4.The light-transmissive member 3, which is disposed on the base 1,transmits at least 50% (preferably 70%) of the light from the lightemitting element 2.

The light-transmissive member 3 is constituted by a single or pluralityof light-transmissive members. In plan view, the light-transmissivemember 3 may be continuously formed in a frame of a polygonal shape,such as a rectangle or hexagon, or in a frame of a circular shape.Alternatively, the light-transmissive member 3 may be constituted by twoor more light-transmissive members, each of which has a shape of a line,a straight rod, or a rod having a bent or curbed portion.

The light emitting element 2 is spaced apart from the light-transmissivemember 3 on the base 1. In the light emitting device 100 according tothe first embodiment, the light-transmissive member 3 is disposed sothat the light emitting element 2 is interposed between a pair of partsof the light-transmissive member 3 when viewed in cross sectionperpendicular to a lengthwise direction of the pair of parts of thelight-transmissibe member 3. Here, the light emitting element 2 beinginterposed between the pair of parts of the light-transmissive member 3means that the light-transmissive member 3 has a pair of opposingportions extending in a predetermined direction and the light emittingelement 2 is located in between the opposing portions. Thelight-transmissive member 3 is disposed so that the light emittingelement 2 is surrounded by the light-transmissive member 3 in plan view.In other words, the light-transmissive member 3 is of a frame-likestructure and has four lateral portions, two of which constitute a firstpair of opposing portions that extends in a predetermined direction andanother two of which constitute a second pair of opposing portions thatextends in a direction perpendicular to the predetermined direction. Thelight emitting element 2 is entirely surrounded by thelight-transmissive member 3 by being interposed in between the firstpair of opposing portions of the light-transmissive member 3 and inbetween the second pair of opposing portions of the light-transmissivemember 3.

Each of the four lateral portions of the light-transmissive member 3 hasan inner lateral surface 31 located on a side of the lateral portionclose to the light emitting element 2 (surface in contact with thelater-described sealing member 4) and formed so as to have an arc shapeor a curved shape protruding toward the sealing member 4 when viewed incross-section perpendicular to a lengthwise direction of the lateralportion. In addition, each of the four lateral portions of thelight-transmissive member 3 is formed so as to have an increasinghorizontal width from top (side of the lateral portion away from thebase 1) to bottom (side of the lateral portion close to the base 1) whenviewed in cross-section perpendicular to a lengthwise direction of thelateral portion.

Meanwhile, each of the four lateral portions of the light-transmissivemember 3 has an outer lateral surface 32 located opposite the lightemitting element 2 and exposed outside as a portion of a (vertical)lateral surface of the light emitting device 100. It is to be noted that“exposed outside” here means that the outer lateral surface 32 of thelight-transmissive member 3 is not sealed from the atmosphere by thesealing member 4. For example, even when the outer lateral surface 32 iscoated (e.g., with silica) to suppress ingress of moisture, the outerlateral surface 32 is to be defined as being exposed.

Examples of the material used for the light-transmissive member 3include a thermosetting resin, such as a silicone resin, an epoxy resin,and a urea resin, which have good light-transmissive properties, and aglass having light-transmissive properties. Specifically, a siliconeresin is preferably used.

The light-transmissive member 3 may contain a light-diffusing material.When the light-transmissive member 3 contains a light-diffusingmaterial, the content of the light-diffusing material is preferably atleast 1% by mass and at most 20% by mass. A light-diffusing materialwith a content of less than 1% by mass fails to provide preferablelight-diffusing properties. A light-diffusing material with a content ofgreater than 20% by mass causes a decrease in the light transmittance ofthe light-transmissive member 3. Thus the content of the light-diffusingmaterial is preferably at least 1% by mass and at most 20% by mass, morepreferably at least 2% by mass and at most 10% by mass, and still morepreferably at least 2% by mass and at most 5% by mass.

The sealing member 4 protects the light emitting element 2 and the likefrom an external force, dust, moisture, and the like and provides goodheat resistance, weather resistance, and light resistance to the lightemitting element 2. The sealing member 4 transmits at least 50%(preferably 70%) of the light emitted from the light emitting element 2and is provided so as to cover the inner lateral surface 31 of each ofthe lateral portions of the light-transmissive member 3, the lightemitting element 2, and a portion of an upper surface of the base 1exposed between the lateral portions of the light-transmissive member 3and the light emitting element 2. Namely, the light emitting device 100according to the first embodiment has an upper surface where the sealingmember 4 is exposed. The light emitting device 100 has (vertical)lateral surfaces each including a lateral surface of a correspondinglateral portion of the light-transmissive member 3 and a lateral surfaceof the sealing member 4. Specifically, each of the lateral surfaces ofthe light emitting device 100 has a lower portion where the lateralsurface of the corresponding lateral portion of the light-transmissivemember 3 is exposed and has an upper portion where the lateral surfaceof the sealing member 4 is exposed, so that the lateral surface of thecorresponding lateral portion of the light-transmissive member 3 and thelateral surface of the sealing member 4 are on the same plane. Notethat, the surfaces of the sealing member 4 in contact with theatmosphere may be coated (e.g., with silica) to suppress ingress ofmoisture, but they are to be defined as being exposed.

Examples of the materials used for the sealing member 4 include athermosetting resin, such as a silicone resin, an epoxy resin, and aurea resin, which have good light-transmissive properties, and a glasshaving light-transmissive properties. Specifically, a silicone resin ispreferably used for the sealing member 4. As a silicone resin, a phenylresin, phenyl rubber, modified silicone, fluororubber, methyl rubber,and phenyl gel may be used. Also, as a silicone resin, phenyl siliconehaving a refractive index of 1.45 to 1.60, methyl phenyl silicone havinga refractive index of 1.40 to 1.50, or methyl silicone having arefractive index of 1.35 to 1.50 may be preferably used. Note that thematerials of the light-transmissive member 3 and the sealing member 4may be the same or different. The use of the same material for thelight-transmissive member 3 and the sealing member 4 is advantageous inpreventing light refraction occurring at a boundary (inner lateralsurface 31) between the light-transmissive member 3 and the sealingmember 4. Meanwhile, the use of different materials for thelight-transmissive member 3 and the sealing member 4 is advantageous inincreasing intensity of light in a desired direction by causingrefraction of light to occur in the boundary (inner lateral surface 31)between the light-transmissive member 3 and the sealing member 4.

The sealing member 4 contains a phosphor 5, which is dispersed in thesealing member 4. The sealing member 4 containing particles of thephosphor 5 facilitates adjustment of the color tone of the lightemitting device 100. As the phosphor 5, a phosphor which has a specificgravity heavier than that of the sealing member 4 and which absorbslight from the light emitting element 2 and performs wavelengthconversion may be used. A phosphor 5 having a specific gravity heavierthan that of the sealing member 4 may be settled down to be arranged inthe vicinity of a surface of the light emitting element 2.

Examples of the phosphor 5 contained in the sealing member 4 include ayellow phosphor, such as Y₃Al₅O₁₂:Ce (YAG) and silicate, and a redphosphor such as CaAlSiN₃:Eu (CASN), (Sr,Ca)AlSiN₃:Eu (SCASN), andK₂SiF₆:Mn (KSF).

The wires 6 electrically connect electrodes of the light emittingelement 2 and the electrodes 12 of the base 1. Note that an end of eachof the wires 6 is connected to a corresponding electrode of the lightemitting element 2 at a bonding point thereof and the other end of thewire 6 is connected to a corresponding electrode of the electrodes 12 ata bonding point thereof. These bonding points are covered by the sealingmember 4.

The light emitting device 100 thus structured performs wavelengthconversion on a part of the light emitted from the light emittingelement 2 by the phosphor 5 contained in the sealing member 4. Theconverted light exits from the upper surface and the lateral surfaces ofthe light emitting device 100. The light emitting device 100 providedwith the light-transmissive member 3 is able to emit light whoseunevenness in chromaticity distribution has been adjusted.

Light Emitting Device Manufacturing Method

Next, description will be given of a method for manufacturing the lightemitting device 100 according to the first embodiment with reference toFIGS. 2 to 3F. FIG. 2 is a flowchart showing a procedure of a method formanufacturing the light emitting device according to the firstembodiment. FIG. 3A is a schematic cross-sectional view showing anaspect of a base preparing step of the method for manufacturing thelight emitting device according to the first embodiment. FIG. 3B is aschematic cross-sectional view showing an aspect of a light emittingelement mounting step of the method for manufacturing the light emittingdevice according to the first embodiment. FIG. 3C is a schematiccross-sectional view showing an aspect of a wiring step of the methodfor manufacturing the light emitting device according to the firstembodiment. FIG. 3D is a schematic cross-sectional view showing anaspect of a light-transmissive member forming step of the method formanufacturing the light emitting device according to the firstembodiment. FIG. 3E is a schematic cross-sectional view showing anaspect of a sealing member forming step of the method for manufacturingthe light emitting device according to the first embodiment. FIG. 3F isa schematic cross-sectional view showing an aspect of a light emittingdevice singulating step of the method for manufacturing the lightemitting device according to the first embodiment.

The method for manufacturing a light emitting device according to thepresent embodiment include the steps of: a base preparing step S11, alight emitting element mounting step S12, a wiring step S13, alight-transmissive member forming step S14, a sealing member formingstep S15, and a light emitting device singulating step S16.

In the method for manufacturing the light emitting device according tothe present embodiment, a base connected body 10 in which a plurality ofbases 1 are continuously formed is processed from the base preparingstep S11 to the sealing member forming step S15. After light emittingdevices 100 are respectively produced on the bases 1, individual lightemitting devices 100 are singulated in the light emitting devicesingulating step S16. Alternatively, only one base 1 or pluralsingulated bases 1 may be used to produce one light emitting device 100or plural light emitting devices 100.

In the base preparing step S11, a base connected body 10, in which aplurality of bases 1 with no light emitting element 2 or the like areformed, is prepared. The base connected body 10 (base 1) can be preparedby: punching a metal plate to form a read frame in which firstelectrodes 121 and second electrodes 122 are formed; sandwiching thelead frame by an upper part and a lower part of a two-piece mold havingcavities corresponding to the shapes of support members 11; andinjecting a resin into the cavities of the mold to form a resin body.

As described, the base connected body 10 (base 1) is a resin package.Alternatively, the base connected body 10 may be a ceramic packageformed by stacking and then sintering green sheets, each of which ismade of a raw material of the ceramic. The base connected body 10 may beproduced by forming an electrically conductive film by applying a metalfoil to or plating a metal on a flat base made of a ceramic material ora resin material and then forming a wiring pattern on the electricallyconductive film by etching. The base connected body 10 (base 1) may beprovided by purchasing.

In the light emitting element mounting step S12, light emitting elements2 are picked up and placed on the base connected body 10 (base 1) atpredetermined locations using a collet or the like, and the baseconnected body 10 (base 1) on which the light emitting elements 2 aredisposed is subjected to a heating process using a reflow furnace tojoin the light emitting elements 2 onto the base connected body 10 (base1).

In the wiring step S13, terminals of each of the light emitting elements2 are electrically connected through wires 6 to the first electrode 121and the second electrode 122 of the corresponding base 1, which serve aselectrodes for external connection. The wires 6 can be wired with a wirebonding machine.

In the light-transmissive member forming step S14, hardening compositionis supplied onto the base connected body 10 (base 1) using a dispenser,then the hardening composition is hardened to form a light-transmissivemember base body 30, from which light-transmissive members 3 are createdlater. The light-transmissive member base body 30 is disposed alongboundaries 1 s of bases 1 so as to surround respective light emittingelements 2 in a grid shape. The dispenser is used to dispose thelight-transmissive member base body 30 by for example linear coating anupper surface of the base connected body 10 (base 1) along theboundaries is of bases 1 in a grid pattern with the hardeningcomposition. The hardening composition of the light-transmissive memberbase body 30 is prepared so as to have a predetermined hardness, appliedfrom the dispenser by linear coating, and then hardened, so that thehardened composition has a cross section having a curved shape. Thehardening composition of the light-transmissive member base body 30 maybe applied to only either rows or columns of the matrix in the gridshape by linear coating.

In the sealing member forming step S15, hardening composition containinga phosphor 5 is supplied by a dispenser onto upper surfaces and lateralsurfaces of the light emitting elements 2, an upper surface and lateralsurfaces of the light-transmissive member base body 30, and an uppersurface of the base connected body 10 (base 1) exposed between rows andcolumns of the light-transmissive member base body 30. After that, thehardening composition is hardened to form a sealing member base body 40,from which sealing members 4 are created later. Here, the sealing memberbase body 40 is formed so as to have a height higher than that of thelight-transmissive member base body 30. That is, the hardeningcomposition containing a phosphor 5 can be supplied over the grid-shapedlight-transmissive member base body 30. This improves productivity.

In the light emitting device singulating step S16, light emittingdevices 100, which have been formed in connection with each other, aresingulated (diced). The light emitting devices 100 are singulated bycutting the base connected body 10 along the boundaries is of the bases1 using a cutter or the like. In other words, the cutting is performedalong paths on which the light-transmissive member base body 30 has beendisposed to singulate the light emitting devices 100. The light emittingdevices 100 are manufactured by carrying out the above-described steps.

These steps allow each of the light emitting elements 2 and thecorresponding light-transmissive member 3 to have a small distancetherebetween. Specifically, the light-transmissive member forming stepS14 is carried out after the light emitting element mounting step S12and the wiring step S13 have been carried out. This allows arranging thelight emitting elements 2, the light-transmissive member 3, and thewires 6 so that the light emitting element 2 and the light-transmissivemember 3 have a small distance therebetween and each of the wires 6 andthe light-transmissive member 3 have a small distance therebetween.Arranging the light emitting element 2 and the light-transmissive member3 to have a small distance therebetween enables to adjust an amount ofthe phosphor 5 in the sealing member 4 present in the horizontaldirection of the light emitting element 2, and thus to adjust unevennessin chromaticity distribution of light.

While a method for manufacturing a light emitting device 100 accordingto the first embodiment has been described, it should be noted that themethod is not limited thereto, and the method may include other stepsbefore, after, or between the steps described.

Although, in the light-transmissive member forming step S14, thelight-transmissive member base body 30 has been described as beingformed so as to not contain bonding points between the wires 6 and theelectrodes 12 (121, 122), and the bonding points have been described asbeing covered by the sealing member 4 later (see FIGS. 1A and 1B), itshould be noted that the method is not limited thereto.

FIG. 4A is a schematic plan view showing a light emitting deviceaccording to a modified embodiment of the first embodiment. FIG. 4B is aschematic cross-sectional view showing the structure of the lightemitting device according to the modified embodiment of the firstembodiment, taken along line IVB-IVB in FIG. 4A. Note that, in FIG. 4A,members disposed below a sealing member 4 containing a phosphor 5 isillustrated seeing through the sealing member 4 and the phosphor 5.

In the light-transmissive member forming step S14 of the modifiedembodiment, the light-transmissive member base body 30 may be formed soas to contain bonding points between the wires 6 and the electrodes 12(121, 122), so that the light-transmissive member 3 contains the bondingpoints (see FIGS. 4A and 4B).

Namely, after the wiring step S13, in the light-transmissive memberforming step S14, hardening composition is supplied onto the baseconnected body 10 (base 1) using a dispenser, then a light-transmissivemember base body 30, from which a light-transmissive member 3 is createdlater, is formed so that each of the four lateral portions of thelight-transmissive member 3 has a large width when viewed incross-section perpendicular to a lengthwise direction of the lateralportion. In other words, the distance between a lateral surface of thelight emitting element 2 and the inner lateral surface 31 of thecorresponding lateral portion of the light-transmissive member 3 is madesmaller than that of the light emitting device 100 illustrated in FIGS.1A and 1B. That means, the length of a light path in the horizontaldirection in the sealing member 4 is made smaller.

Optical Simulation

A simulation was conducted to verify the working effect of the lightemitting device 100 according to the first embodiment and the modifiedembodiment thereof. FIG. 5A is a schematic plan view illustratingparameters of a light emitting device to be simulated. FIG. 5B is aschematic cross-sectional view illustrating parameters of the lightemitting device to be simulated, taken along line VB-VB in FIG. 5A. Notethat, in FIG. 5A, members disposed below a sealing member 4 containing aphosphor 5 is illustrated seeing through the sealing member 4 and thephosphor 5. FIG. 6 is a graph showing relations between directionalangles and chromaticity (chromaticity coordinate x) of light emittedfrom light emitting devices having light-transmissive members withdifferent widths W₃. In FIG. 6, the abscissa represents the directionalangle θ in the range of ±85° and the ordinate represents thechromaticity of light (chromaticity coordinate x). Note that thedirectional angle θ is relative to the light axis (θ=0°) of the lightemitting element 2. Note that the graph plots the chromaticitycoordinate x only. The relations of other values (chromaticitycoordinate y, Y color value and the like) to the directional angle havetendencies similar to the one shown in FIG. 6 and thus illustration ofthose relations are omitted.

The simulation was conducted using the parameters according to thefollowing conditions. It was assumed that, as to the light emittingdevice 100 to be simulated, when viewed in plan, the light emittingdevice 100 and the light emitting element 2 each had a square shape; alength W₁ of each of the four laterals of the light emitting device 100(in other words, the width of the base 1) was 3000 μm; a length W₂ ofeach of the four laterals of the light emitting element 2 was 650 μm;and that the light emitting element 2 was positioned at the center ofthe base 1.

It was assumed that, as to the light emitting device 100 to besimulated, when viewed in vertical cross-section, the base 1 had athickness t1 of 200 μm; the light emitting element 2 had a thickness t₂of 150 μm; the light-transmissive member 3 had a thickness t₃ of 300 μm,where t₃ was defined as the height of the outer lateral surface 32,which was a portion of the light-transmissive member 3 exposed in alateral surface of the light emitting device 100; the sealing member 4covered a portion of the upper surface of the base 1 and had a thicknesst₄ of 450 μm, where t₄ was defined as the height of the upper surface ofthe sealing member 4 from the upper surface of the base 1.

The simulation was conducted varying the width W₃ of thelight-transmissive member 3 as 0, 300, 500, and 700 μm, where W₃ wasdefined as the width of a lower surface of each of the four lateralportions of the light-transmissive member 3, which lower surface is incontact with the base 1, as viewed in cross-section perpendicular to alengthwise direction of the lateral portion. Note that W₃ being 0 μmmeans that the light emitting device 100 is sealed by the sealing member4 without having a light-transmissive member 3. It was assumed that thelight emitting element 2 and the light-transmissive member 3 have adistance W₂₃ therebetween, where W₂₃ was defined as the minimum distancebetween a lateral surface of the light emitting element 2 and the innerlateral surface 31 of the lateral portion of the light-transmissivemember 3 facing the lateral surface of the light emitting element 2. Inother words, W₂₃=W₁/2−W₂/2−W₃=1175−W₃.

It was assumed that a cross-section of the inner lateral surface 31 of alateral portion of the light-transmissive member 3, shown in thecross-sectional view in FIG. 5B, was shaped in a quarter ellipse whosefirst radius is t₃ and whose second radius is W₃. It was assumed thatthe light emitting element 2 is a single wavelength light sourceemitting a wavelength of 450 nm. It was assumed that the material forthe light-transmissive member 3 was a phenyl silicone, and that thematerial for the sealing member 4 was a phenyl silicone in whichY₃Al₅O₁₂:Ce (YAG) was dispersed as a phosphor 5. The number of phosphorparticles in the sealing member of each light emitting device 100 wasadjusted so that the light emitting device 100 has a chromaticitycoordinate x of about 0.345 at directional angles θ of ±60°.

Incidentally, pseudo-white light composed of blue light and yellow lightand having a larger amount of yellow light has a greater value ofchromaticity coordinate x. A light emitting device 100 is said to havesmaller unevenness in chromaticity distribution of light when there is asmaller variation in chromaticity (chromaticity coordinate x) relativeto a variation of the directional angle θ, in other words, when there isa smaller difference between a maximum value and a minimum value ofchromaticity (chromaticity coordinate x).

The result of the simulation is as follows. The light emitting device100 with no light-transmissive member 3 (W₃=0 μm) had a difference of0.06 between a maximum value 0.38 and a minimum value 0.32 of thechromaticity coordinate x. In contrast, the light emitting device 100with a light-transmissive member 3 having a width W₃ of 300 μm had adifference of 0.05 between a maximum value 0.37 and a minimum value 0.32of the chromaticity coordinate x. The light emitting device 100 with alight-transmissive member 3 having a width W₃ of 500 μm had a differenceof 0.04 between a maximum value 0.36 and a minimum value 0.32 of thechromaticity coordinate x. The light emitting device 100 with alight-transmissive member 3 having a width W₃ of 700 μm had a differenceof 0.02 between a maximum value 0.35 and a minimum value 0.33 of thechromaticity coordinate x. As shown in the result, a light emittingdevice 100 with a light-transmissive member 3 having a larger width W₃,in other words, a light emitting device 100 with a light emittingelement 2 and a light-transmissive member 3 having a smaller distanceW₂₃ therebetween, has a smaller difference between a maximum value and aminimum value of the chromaticity coordinate x.

As shown, the light emitting device 100 according to the firstembodiment can have adjusted unevenness in chromaticity distribution byhaving the light-transmissive member 3. In particular, as described inthe description of the light-transmissive member forming step S14, thelight-transmissive member base body 30 (light-transmissive member 3) isformed by supplying hardening composition onto the base 1 by linearcoating or the like after the wires 6 are bonded, so that the lightemitting element 2 and the light-transmissive member 3 can have adistance W₂₃ therebetween of at most three-quarters (more preferably ofabout one-quarter) the width W₂ of a lateral of the light emittingelement 2 and thus the light emitting device 100 can have preferablyadjusted unevenness in chromaticity distribution.

Preferably, the width W₃ of the light-transmissive member is at least 50μm and the height (thickness) t₃ of the light-transmissive member 3 isat least 50 μm as viewed in cross-section perpendicular to a lengthwisedirection of a lateral portion of the light-transmissive member 3. Witha light-transmissive member 3 not meeting the above condition, theunevenness in chromaticity distribution is not sufficiently adjusted.

Preferably, the sealing member 4 has a thickness of at least 50 μm abovethe light emitting element 2, i.e., t₄−t₂≥50 μm. With a sealing member 4not meeting the above condition, there is no sufficient effect of thesealing member 4 in protecting the light emitting element 2 and the likefrom an external force, dust, moisture, and the like.

Preferably, the thickness of the sealing member 4 directly above thelight-transmissive member 3 (i.e., t₄−t₃) is at least 30 μm and at most3 mm, more preferably at least 50 μm and at most 1 mm, and still morepreferably at least 100 μm and at most 500 μm.

Preferably, the light-transmissive member 3 has a height (thickness) t₃the ratio of which to the width W₃ of the light-transmissive member 3 isat least 0.3 and at most 2.0. With this structure, chromaticitydistribution is favorably adjusted.

Preferably, the ratio of W₂₃ to (t₄−t₂) is at least 0.8 and at most 2.0,where W₂₃ is the distance between an inner lateral surface 31 of alateral portion of the light-transmissive member 3 and the lateralsurface of the light emitting element 2 facing the inner lateral surface31, and (t₄−t₂) is the thickness of the sealing member 4 directly abovethe light emitting element 2. With this structure, a part of lightemitted in a vertically upward direction and a part of light emitted ina horizontal direction have approximately the same length of light pathin the sealing member 4, or the former has a longer light path in thesealing member 4 than that of the latter. This facilitates adjustment ofchromaticity distribution of light.

Preferably, the sealing member 4 has a height (thickness) t₄ the ratioof which to the height (thickness) t₂ of the light emitting element 2 isat least 1.2 and at most 6.0. With this structure, a part of lightemitted in a vertically upward direction has a longer light path andthus the light-transmissive member 3 can have a smaller width W₃ toadjust chromaticity distribution of light. Namely, chromaticitydistribution of light can be more easily adjusted.

Second Embodiment Configuration of Light Emitting Device

Description will be given of a light emitting device 100A according to asecond embodiment with reference to FIGS. 7A and 7B. FIG. 7A is aschematic plan view showing the structure of a light emitting deviceaccording to the second embodiment of the present disclosure. FIG. 7B isa schematic cross-sectional view showing the structure of the lightemitting device according to the second embodiment, taken along lineVIIB-VIIB in FIG. 7A. FIG. 7C is a schematic cross-sectional viewshowing the structure of the light emitting device according to thesecond embodiment, taken along line VIIC-VIIC in FIG. 7A. Note that, inFIG. 7A, members disposed below a sealing member 4 containing a phosphor5 are illustrated seeing through the sealing member 4 and the phosphor5.

In the light emitting device 100 according to the first embodiment, thelight-transmissive member 3 is provided so that the light emittingelement 2 is surrounded by the four lateral portions of thelight-transmissive member 3. In contrast, a light emitting device 100Aaccording to the second embodiment has two light-transmissive members3A. Specifically, in the light-transmissive member forming step S14, thelight-transmissive member base body 30 is formed in a plurality ofparallel rows rather than rows and columns of a grid, by linear coatingor the like. Namely, in the light emitting device 100A according to thesecond embodiment, a pair of light-transmissive members 3A extending ina predetermined direction are provided such that, as viewed incross-section perpendicular to the predetermined direction, the lightemitting element 2 is interposed between the pair of light-transmissivemembers 3A. The pair of light-transmissive members 3A corresponds to apair of lateral portions of the light-transmissive member 3 according tothe first embodiment. Even with such a structure of the light emittingdevice 100A, light chromaticity distribution in directional anglesperpendicular to the predetermined direction can be adjustable.

Third Embodiment Configuration of Light Emitting Device

Description will be given of light emitting devices 100B and 100Caccording to a third embodiment with reference to FIGS. 8 and 9. FIG. 8is a schematic cross-sectional view showing the structure of a lightemitting device according to the third embodiment of the presentdisclosure. FIG. 9 is a schematic cross-sectional view showing thestructure of a light emitting device according to a modified embodimentof the third embodiment.

In the light emitting device 100 according to the first embodiment, theinner lateral surface 31 of each of the four lateral portions of thelight-transmissive member 3 has an arc shape or a curved shape whenviewed in cross-section perpendicular to a lengthwise direction of thelateral portion. Likewise, in the light emitting device 100A accordingto the second embodiment, the inner lateral surface 31 of each of thepair of light-transmissive members 3A has an arc shape or a curved shapewhen viewed in cross-section perpendicular to a lengthwise direction ofthe light-transmissive member 3A. A light emitting device 100B accordingto the third embodiment has a light-transmissive member 3B having fourlateral portions like the first embodiment. However, each of the fourlateral portions has a flat inner lateral surface 311 and a flat uppersurface 312 such that, when viewed in cross-section perpendicular to alengthwise direction of the lateral portion, the flat inner lateralsurface 311 and the flat upper surface 312 each have a linear shape andas a result the lateral portion has a trapezoidal shape. A lightemitting device 100C according to a modified embodiment of the thirdembodiment has a light-transmissive member 3C having four lateralportions like the first embodiment. However, each of the four lateralportions of the light-transmissive member 3C has a flat inner lateralsurface 313 such that, when viewed in cross-section perpendicular to alengthwise direction of the lateral portion, the flat inner lateralsurface 313 has a linear shape extending from a lateral surface of thelight emitting device 100C to the base 1 and as a result the lateralportion has a triangular shape. Specifically, in the light-transmissivemember forming step S14, hardening composition is supplied onto the baseconnected body 10 (base 1) by linear coating or the like, and then thehardening composition is processed so as to have a predetermined shapebefore or after the hardening composition is hardened. Chromaticitydistribution can be adjustable with those structures.

When the material (hardening composition) of the light-transmissivemember(s) (light-transmissive member(s) 3, 3A, 3B, or 3C) and thematerial (hardening composition) of the sealing member 4 are differentfrom each other, light refraction occurs at a boundary between thelight-transmissive member(s) and the sealing member 4. The boundarybetween the light-transmissive member(s) and the sealing member 4, i.e.,the inner lateral surface of each of the lateral portions of thelight-transmissive member(s) can be designed so as to control therefraction of light to have desired luminance distribution.

Note that the shape of the inner lateral surface of each of the fourlateral portions of the light-transmissive member(s) (light-transmissivemember(s) 3, 3A, 3B, or 3C) is not limited to the above-describedshapes. For example, the inner lateral surface may be formed so as tohave grooves or surface unevenness.

Fourth Embodiment Configuration of Light Emitting Device

Description will be given of a light emitting device 200 according to afourth embodiment with reference to FIGS. 10A and 10B. FIG. 10A is aschematic plan view showing the structure of a light emitting deviceaccording to the fourth embodiment of the present disclosure. FIG. 10Bis a schematic cross-sectional view showing the structure of the lightemitting device according to the fourth embodiment, taken along lineXB-XB in FIG. 10A. Note that, in FIG. 10A, members disposed below asealing member 4 containing a phosphor 5 are illustrated seeing throughthe sealing member 4 and the phosphor 5.

An light emitting device 200 according to the fourth embodiment is of asubstantially rectangular parallelepiped shape as a whole and mainlyhas: a light emitting element 2; a light-transmissive member 3 arrangedso as to surround the light emitting element 2 with a gap in between thelight-transmissive member 3 and the light emitting element 2; and asealing member 4 that covers an upper surface of the light-transmissivemember 3 and an upper surface and lateral surfaces of the light emittingelement 2.

The light emitting element 2 of the light emitting device 200 accordingto the fourth embodiment is a light emitting diode that emitshigh-brightness blue light using a nitride semiconductor. The lightemitting element 2 is of a face-down mounting type having positive andnegative electrodes on an lower surface thereof (surface opposite to thesurface covered by the sealing member 4). The light emitting element 2emits light when electrical power is supplied through the electrodes ofthe light emitting element 2.

The light-transmissive member 3 is spaced apart from the light emittingelement 2. In the light emitting device 200 according to the fourthembodiment, the light-transmissive member 3 has four lateral portions,two of which constitute a first pair of opposing portions that extendsin a predetermined direction and another two of which constitute asecond pair of opposing portions that extends in a directionperpendicular to the predetermined direction. The light emitting element2 is entirely surrounded by the light-transmissive member 3 by beinginterposed in between the first pair of opposing portions of thelight-transmissive member 3 and in between the second pair of opposingportions of the light-transmissive member 3. However, the light emittingdevice 200 may be configured to have two light-transmissive members 3Alike the light emitting device 100A according to the second embodiment.Each of the four lateral portions of the light-transmissive member 3 hasan inner lateral surface 31 that is formed so as to have an arc shape ora curved shape protruding toward the sealing member 4 when viewed incross-section perpendicular to a lengthwise direction of the lateralportion. However, the inner lateral surface 31 may be formed so as tohave a linear shape when viewed in cross-section perpendicular to alengthwise direction of the lateral portion, like the light emittingdevices 100B and 100C according to the third embodiment.

The sealing member 4 is formed so as to cover the inner lateral surfaces31 of the four lateral portions of the light-transmissive member 3 andthe upper surface and lateral surfaces of the light emitting element 2.Namely, the sealing member 4 is exposed at an upper surface of the lightemitting device 200 according to the fourth embodiment. The lightemitting device 200 has (vertical) lateral surfaces each including alateral surface of the corresponding lateral portion of thelight-transmissive member 3 and a lateral surface of the sealing member4. In other words, each of the lateral surfaces of the light emittingdevice 200 has a lower lateral portion where the lateral surface of thecorresponding lateral portion of the light-transmissive member 3 isexposed and has an upper lateral portion where the lateral surface ofthe sealing member 4 is exposed. The light emitting device 200 has abottom surface that has: a peripheral portion at which a bottom surfaceof the light-transmissive member 3 is exposed; a middle portion at whicha bottom surface of the light emitting element 2 is exposed, on whichbottom surface the electrodes of the light emitting element 2 areprovided; and an intermediate portion which is located between the outerperipheral portion and the middle portion and at which a bottom surfaceof the sealing member 4 is exposed. Namely, the bottom surfaces of thefour lateral portions of the light-transmissive member 3, the bottomsurface of the light emitting element 2, and the bottom surface of thesealing member 4 constitute the bottom surface of the light emittingdevice 100.

Other structures of the light emitting device 200 is the same as thoseof the light emitting device 100 according to the first embodiment, andthus overlapping description is omitted.

Light Emitting Device Manufacturing Method

Next, description will be given of a method for manufacturing a lightemitting device 200 according to the fourth embodiment with reference toFIGS. 11 to 12F. FIG. 11 is a flowchart showing a procedure of themethod for manufacturing the light emitting device 200 according to thefourth embodiment. FIG. 12A is a schematic cross-sectional view showingan aspect of a base preparing step of the method for manufacturing thelight emitting device 200 according to the fourth embodiment. FIG. 12Bis a schematic cross-sectional view showing an aspect of a lightemitting element fixing step of the method for manufacturing the lightemitting device 200 according to the fourth embodiment. FIG. 12C is aschematic cross-sectional view showing an aspect of a light-transmissivemember forming step of the method for manufacturing the light emittingdevice 200 according to the fourth embodiment. FIG. 12D is a schematiccross-sectional view showing an aspect of a sealing member forming stepof the method for manufacturing the light emitting device 200 accordingto the fourth embodiment. FIG. 12E is a schematic cross-sectional viewshowing an aspect of a base removing step of the method formanufacturing the light emitting device 200 according to the fourthembodiment. FIG. 12F is a schematic cross-sectional view showing anaspect of a light emitting device singulating step of the method formanufacturing the light emitting device 200 according to the fourthembodiment.

The method for manufacturing a light emitting device 200 according tothe fourth embodiment includes the steps of a base preparing step S21,light emitting element fixing step S22, a light-transmissive memberforming step S23, a sealing member forming step S24, a base removingstep S25, and a light emitting device singulating step S26.

In the base preparing step S21, a base 15 on which light emittingelements 2 or the like have not been disposed is prepared. A flexiblesheet member such as one made of a polyimide is used as the base 15 sothat the base 15 may be easily removed by peeling-off in thelater-described base removing step S25. The flexible sheet member has anupper surface on which an adhesive layer is formed to fix light emittingelements 2 in the later-described light emitting element fixing stepS22.

In the light emitting element fixing step S22, light emitting elements 2are picked up, placed, and fixed on the base 15 at predeterminedlocations using a collet or the like. The light emitting elements 2 arefixed on the base 15 by applying ultra-violet radiation on the adhesivelayer of the base 15 to harden the adhesive layer.

In the light-transmissive member forming step S23, hardening compositionis supplied onto the base 15 using a dispenser, then alight-transmissive member base body 30, from which light-transmissivemembers 3 are created later, is formed by hardening the hardeningcomposition. The light-transmissive member base body 30 is disposed onthe upper surface of the base 15 along boundaries 1 s of light emittingdevices 200 so that light emitting elements 2 thereof are eachsurrounded by the light-transmissive member base body 30 in a gridpattern. The dispenser is used to dispose the light-transmissive memberbase body 30 by linear coating the hardening composition on the uppersurface of the base 15 in a grid pattern along the boundaries 1 s of thelight emitting devices 200.

In the sealing member forming step S24, hardening composition containinga phosphor 5 is supplied by a dispenser onto upper surfaces and lateralsurfaces of the light emitting elements 2, an upper surface and lateralsurfaces of the light-transmissive member base body 30, and an uppersurface of the base 15. After that, the hardening composition ishardened to form a sealing member base body 40 from which sealingmembers 4 are created later.

In the base removing step S25, the base 15 is removed (peeled-off) fromthe structure composed of light emitting elements 2, thelight-transmissive member base body 30, and the sealing member base body40, and the base 15.

In the light emitting device singulating step S26, the light emittingdevices 200, which have been formed in connection with each other, aresingulated (diced). The singulation of the light emitting devices 200 isperformed by cutting the structure along the boundaries 1 s using acutter or the like. In other words, the cutting is performed along pathson which the light-transmissive member base body 30 has been disposed tosingulate the light emitting devices 200. The light emitting devices 200are manufactured by carrying out the above-described steps.

The light emitting device 200 according to the fourth embodiment canhave adjusted unevenness in chromaticity distribution by having thelight-transmissive member 3 like the light emitting device 100 accordingto the first embodiment.

In each of the light emitting devices according to the above first,third, and forth embodiments, the light emitting device has beendescribed as having a single light-transmissive member formed in acontinuously-formed frame structure having four lateral portions, two ofwhich constitute a first pair of opposing portions that extends in apredetermined direction and another two of which constitute a secondpair of opposing portions that extends in a direction perpendicular tothe predetermined direction, and a light emitting element is surroundedby the first and second pairs of opposing portions. In this case, thefour lateral portions of the light-transmissive member are continuouslyformed in the frame structure. However, the four lateral portions of thelight-transmissive member may not necessarily be continuously formed.For example, the light emitting device may have, in place of the singlelight-transmissive member, four separate light-transmissive members twoof which constitute a first pair corresponding to the first pair ofopposing portions and another two of which constitute a second paircorresponding to the second pair of opposing portions. The first andsecond pair of light-transmissive members are disposed such that ends ofthe first pair of light-transmissive members are respectively locatedadjacent to ends of the second pair of light-transmissive members toform a frame-like structure surrounding the light emitting element.

More generaly, the number of the light-transmissive members is notlimited to those above-described as long as the light emitting elementis interposed between a pair of opposing portions of light transmissivemembers or surrounded by two pairs of opposing portions of thelight-transmissive members.

In each of the light emitting devices according to the above first tofourth embodiments, the sealing member has been described as beingdisposed so as to cover the inner lateral surfaces and the upper surfaceof each of the lateral portions of the light-transmissive member(s).However, the upper surface of the lateral portion may be partiallycovered by the sealing member. For example, the sealing member may bedisposed such that only an inner portion of the upper surface located onthe lateral thereof closer to the light emitting element is covered bythe sealing member and an outer portion of the upper surface located onthe outer lateral of the inner portion is exposed. In this case, whenthe phosphor in the sealing member is settled down in the sealing memberforming step, since no phosphor is settled down onto the outer portionof the upper surface of the lateral portion, the amount of the phosphorpresent in lateral directions of the light emitting element is reducedand thus amount of yellow light emitted from the laterals of the lightemitting device is reduced. This facilitates adjustment of unevenness inchromaticity distribution of light.

What is claimed is:
 1. A method for manufacturing a light emittingdevice, comprising the steps of: disposing a light emitting element on abase; disposing a single or plurality of light-transmissive members onthe base so that the light emitting element is interposed between andspaced apart from at least one pair of opposing portions of the singleor plurality of light-transmissive members; covering the base, the atleast one pair of opposing portions of the single or plurality oflight-transmissive members, and the light emitting element with asealing member containing a phosphor; and cutting the base, the at leastone pair of opposing portions of the single or plurality oflight-transmissive members, and the sealing member, along paths on whichthe at least one pair of opposing portions are disposed.
 2. A method formanufacturing a light emitting device, comprising the steps of:disposing a light emitting element on a base; disposing a single orplurality of light-transmissive members on the base so that the lightemitting element is interposed between and spaced apart from at leastone pair of opposing portions of the single or plurality oflight-transmissive members; covering the base, the at least one pair ofopposing portions of the single or plurality of light-transmissivemembers, and the light emitting element with a sealing member containinga phosphor; separating the base from the light emitting element, thesingle or plurality of light-transmissive members, and the sealingmember; and cutting the at least one pair of opposing portions of thesingle or plurality of light-transmissive members and the sealingmember, along paths on which the at least one pair of opposing portionsare disposed.
 3. The method for manufacturing a light emitting deviceaccording to claim 1, wherein the base has a conductive portion and aninsulative portion, wherein the light emitting element has a lowersurface facing the base and an upper surface opposite to the lowersurface and has an electrode on the upper surface, the method furthercomprising the step of: after the step of disposing the light emittingelement and before the step of disposing the single or plurality oflight-transmissive members, connecting a wire between the electrode ofthe light emitting element and the conductive portion of the base tomake an electrically conductive connection therebetween.
 4. The methodfor manufacturing a light emitting device according to claim 1, whereinin the step of disposing the single or plurality of light-transmissivemembers, the single or plurality of light-transmissive members areformed by supplying hardening composition onto the base.
 5. The methodfor manufacturing a light emitting device according to claim 3, whereinin the step of disposing the single or plurality of light-transmissivemembers, the single or plurality of light-transmissive members areformed by supplying hardening composition onto the base so that aconnecting portion connecting the wire to the conductive portion iscovered by the hardening composition.
 6. The method for manufacturing alight emitting device according to claim 1, wherein the at least onepair of opposing portions of the single or plurality oflight-transmissive members comprises two sets of the pair of opposingportions such that the light emitting element is surrounded by andspaced apart from the two sets of the pair of opposing portions.
 7. Themethod for manufacturing a light emitting device according to claim 1,wherein the step of disposing the single or plurality oflight-transmissive members disposes the single or plurality oflight-transmissive members by linear coating.
 8. The method formanufacturing a light emitting device according to claim 1, wherein thestep of cutting is performed in such a manner as to create a workpiecehaving an outer side surface including: a first surface of the at leastone pair of opposing portions of the single or plurality oflight-transmissive members; and a second surface of the sealing member,the first surface and the second surface created during the step ofcutting and being flush with each other.
 9. The method for manufacturinga light emitting device according to claim 2, wherein the step ofdisposing the single or plurality of light-transmissive members disposesthe single or plurality of light-transmissive members by linear coating.10. The method for manufacturing a light emitting device according toclaim 2, wherein the step of cutting is performed in such a manner as tocreate a workpiece having an outer side surface including: a firstsurface of the at least one pair of opposing portions of the single orplurality of light-transmissive members; and a second surface of thesealing member, the first surface and the second surface created duringthe step of cutting and being flush with each other.
 11. The method formanufacturing a light emitting device according to claim 1, wherein thestep of disposing the single or plurality of light-transmissive membersand the step of covering are performed so that the single or pluralityof light-transmissive members each have an arch-shape or curved shapeprotruding toward the sealing member in cross sectional view.
 12. Themethod for manufacturing a light emitting device according to claim 1,wherein the single or plurality of light-transmissive members contain alight-diffusing material whose content is at least 1% by mass and atmost 20% by mass.
 13. The method for manufacturing a light emittingdevice according to claim 1, further comprising a step of: causing thephosphor to be settled down to be arranged in the vicinity of a surfaceof the light emitting element.
 14. The method for manufacturing a lightemitting device according to claim 1, wherein the step of disposing thesingle or plurality of light-transmissive members, the step of covering,and the step of cutting are performed in such a manner as to create aworkpiece including a part of the at least one pair of opposing portionsof the single or plurality of light-transmissive members, the parthaving a width of at least 50 μm and a height of at least 50 μm, andwherein the step of covering is performed so that the sealing member hasa thickness of at least 50 μm above the at least one pair of opposingportions of the single or plurality of light-transmissive members. 15.The method for manufacturing a light emitting device according to claim1, wherein the step of disposing the single or plurality oflight-transmissive members, the step of covering, and the step ofcutting are performed in such a manner as to create a workpieceincluding a part of the at least one pair of opposing portions of thesingle or plurality of light-transmissive members, the part having aheight-to-width ratio of at least 0.3 and at most 2.0.
 16. The methodfor manufacturing a light emitting device according to claim 1, whereinthe step of disposing the light emitting element, the step of disposingthe single or plurality of light-transmissive members, and the step ofcovering are performed so that each of the at least one pair of opposingportions of the single or plurality of light-transmissive members has aninner lateral surface, that the light emitting device has a firstdistance between each of the inner lateral surfaces of the pair ofopposing portions of the single or plurality of light-transmissivemembers and a lateral surface of the light emitting element facing theinner lateral surface, and that a ratio of the first distance to athickness of the sealing member directly above the light emittingelement is at least 0.8 and at most 2.0.
 17. The method formanufacturing a light emitting device according to claim 1, wherein thestep of covering is performed so that the sealing member has a firstheight from the base and a ratio of the first height to a second heightof the light emitting element is at least 1.2 and at most 6.0.
 18. Themethod for manufacturing a light emitting device according to claim 1,wherein the single or plurality of light-transmissive members are madeof a silicone resin.
 19. The method for manufacturing a light emittingdevice according to claim 1, wherein the sealing member is made of asilicone resin.
 20. The method for manufacturing a light emitting deviceaccording to claim 1, wherein the single or plurality oflight-transmissive members and the sealing member are made of a samematerial.